Supermicro, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, announces the appointment of Robert Blair to the Board of Directors.
“The Board of Directors and I are excited that Robert Blair has joined Supermicro as a Director,” said Charles Liang, chairman of Supermicro’s Board of Directors. “Robert has extensive experience as a CEO successfully leading teams and driving product innovation in new technology markets, and we look forward to his contributions to our future growth.”
Blair was President and Chief Executive Officer of ESS Technology, Inc. (“ESS”), a fabless semiconductor company, for 19 years from September 1999 through July 2018, where he also served as a director from September 1999 through August 2019. During this time, ESS was a publicly listed company on NASDAQ for 9 years. Mr. Blair has been a director of Pictos, Inc., a technology licensing company that owns a portfolio of fundamental CMOS imaging patents, since July 2008, where he also previously served as President and Chief Executive Officer between 2008 and 2013. His professional background also includes more than 35 years of experience in marketing, sales, engineering, operations, and general management, principally in the computer hardware, software, and semiconductor industries. His experience includes roles at Global Semiconductor Alliance, Logistix Corporation, and XEMAG (a division of Xidex Corporation). Mr. Blair holds twelve issued U.S. patents plus additional patents worldwide, and studied electrical engineering at Arizona State University and applied economics at the University of San Francisco.
Supermicro is a global enabler in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure.
The company is transforming into a Total IT Solutions provider with server, AI, storage, IoT, and switch systems, software, and services while delivering advanced high-volume motherboard, power, and chassis products.
The products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing).
